ASDH1000 In IC package process, each device on a wafer is divided into good or bad one by testing its electric characteristic with wafer probe. This is the equipment to pick up proper chip from the wafer by using those information and to load it on the tray.
Contact Information:
Company Name:
Motech Taiwan Automatic Corp.
Contact Person:
Mr. Shi
Address:
No.3 Yungshing Road Daya Shiang Taichung Taiwan 428 R.O.C.
