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Features & Applications :
1.With high accuracy, this machine can lap work piece to 0.2u-0.5u flatness, Rmax 0.1S roughness.
2.Work piece can lay on the lapping plate without using magnetic chuck. No deformity will be happened to work piece even the thickness of work piece is smaller than 0.2mm.
3.Any material of work piece will be available for lapping.
4.Workpiece of different shapes and various materials can be lapped simultaneously.
5.Flatness maintenance of lapping plate can also be treated while lapping.
Grinded objects :
IC circuit board, silicon chip, precious stone, optic glass, ceramic sheet,
ore-sintering component, valve pad, precision metal parts.
Sleeves, valve board, mechanical seals, clutch board, concentric ring, crystal
vibrator, air compressor, vacuum pump, freezer valve.
Grinded materials :
cast iron, aluminum, platinum, gold, silver, copper, steel alloy, glass, rubber, plastic, marble, granite, silicone, quartz ceramics, nylon, carbon. |
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