Product Description:
The purpose of ASSH3000 is to sort the different marks (X marks / laser marks / or others) from BGA substrates to designate locations. It is using the vision system function to do this sorting job.
Product Description:
This is an automatic PCB substrate clean loader / unloader machine; its main purpose is to load the Substrate into the clean feeding band for cleaning, and collected together by the clean delivery band.
Product Description:
LASER SCANNER LOADER/UNLOADER THE MODEL LSLU3000 The Best 3D Inspection Solution For BGA/CSP Selection TRAY Or Tape & Reel package consistently stable measurement machinery.
Product Description:
ASDH1000 In IC package process, each device on a wafer is divided into good or bad one by testing its electric characteristic with wafer probe. This is the equipment to pick up proper chip from the wafer by using those information and to load it on the tray.
Product Description:
AUTO DIE BOND SYSTEM, the model DBLF1000, a semi-automatic machine, was designed for the demand of Die sticks onto a conducting wire by means of manual delivering. With regard to different types of conducting wires, it only needs to adjust parameters via touch panel. It is quite easy and convenient to operate the machine for the user. The same type but different sizes of Die also can be applied to just through an ease modulation. Auto Die Bond System can make your company obtain the highest beneficial result. Motech devoted to high precision reliable equipment and professional service as our o
Product Description:
PICK & PLACE LOADER/UNLOADER (L/UL), the model PPLU800, was designed for the demand of IC burn-in industry. The features are more productivity. Wide range of application and high reliability to maximize productivity. Adoption of windows98 OS (Human machine interface) in Pick & Place L/UL is the most friendly and easy to operate. Pick & Place L/UL can make your company obtain the highest beneficial result. Motech devoted to high precision reliable equipment and professional service as our orientation to provide semiconductor industry with more advanced. High speed productive machinery.
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